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Substrate Wetting

Effective substrate wetting promotes rapid and uniform spreading of the formulation. Surface tension differences are balanced to avoid defects such as crawling or pinholing. The result is complete coverage and improved adhesion.

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Bottle representation of TEGO® Wet 288

TEGO® Wet 288

NEW

TEGO Wet 288 is a hydrophobic siloxane-based substrate wetting additive with excellent surface tension reduction. It is highly suitable for waterborne and radiation curing inkjet inks, printing inks and varnishes

company logo of Evonik
Technologies
Radiation curing systems
Solventborne
Waterborne
Bottle representation of TEGO® Rad 2330

TEGO® Rad 2330

TEGO® Rad 2330 is an efficient low-foaming radically cross-linkable substrate wetting and slip additive, providing wetting and flow properties. Recommended for broad areas of application.

company logo of Evonik
Technologies
Radiation curing systems
Bottle representation of TEGO® Glide 432

TEGO® Glide 432

TEGO® Glide 432 shows very good slip and substrate wetting properties. It is highly recommended for radiation-curable coatings.

company logo of Evonik
Technologies
High solids (solventborne)
Radiation curing systems
Solventborne
Waterborne
Bottle representation of TEGO® Rad 2250

TEGO® Rad 2250

TEGO® Rad 2250 is a broadly usable radically cross-linkable slip and substrate wetting agent. It provides efficient wetting, slip, and flow combined with very good compatibility. Ideal for radiation-curing varnishes.

company logo of Evonik
Technologies
High solids (solventborne)
Radiation curing systems
Solventfree
Waterborne
Bottle representation of TEGO® Wet 270

TEGO® Wet 270

TEGO® Wet 270 shows excellent anti-crater properties with flow promotion in waterborne, solventborne, and radiation-curing coatings.

company logo of Evonik
Technologies
Radiation curing systems
Solventborne
Waterborne

Selected country: Germany

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